TEC1-12706 12703 12704 12705 12708 12709 12710 12712 12715 Thermoelectric Cooler Peltier 40*40mm 12V Peltier Elemente Module

Description : Chill ice in minutes or heat to a boil by simply reversing the polarity. It is used for many applications from CPU coolers to redundant power sources. or even for yourself Car warmer/cooler This is because it is primarily composed of a semiconductor material sandwiched between the ceramic plates and has no moving parts. These devices must be used in conjunction with a heat sink to avoid burns. Each device is fully inspected and tested TEC1-12703 40*40 12V3A Model:TEC1-12703. Voltage:12V Rated current:3A Cooling capacity:29.7W Maximum temperature difference:65 ° Size:40*40*4.6 Positive and negative: red positive, black negative

TEC1-12704 40*40 12V4A Chip type: TEC1-12704 Overall size: 40*40*4.0mm 127 Wire specifications: lead length 300+5mm RV single-head standard wire 5mm tin-plated Internal resistance: 3.0~3.3 Ohm (ambient temperature 23 - 1 DEG C, 1kHZ Ac) Maximum temperature: Tmax (Qc=0) 63 DEG C. Operating current: Imax=4A (voltage) Voltage: DC12V (Vmax: 15.5V) Power Cooling capacity: Qcmax 36W Assembly pressure: 85N/cm2 Working environment: temperature range -55 DEG C to 83 C (high ambient temperatures will directly affect the efficiency of the chiller) Packaging: Standard silicone rubber seal. 704 Packaging standards: foam box packaging, storage conditions. Ambient temperature -10 C ~ 40 C Storage conditions: -40~60

TEC1-12705 40*40 Chip Type: TEC1-12705 Size: 40*40*3.8mm Element number 127 on Internal resistance: 2.5~2.8Ω (ambient temperature 23 ± 1, Ac test 1kHZ) Maximum temperature: Tmax (Qc = 0) greater than 67 Working current: Imax = 4.3-4.6A (rated at 12V) Voltage: 12V (Vmax: 15V starting current 5.8A) Cooling power: Qcmax 50-60W Working environment: Temperature range -55 ~ 83 (higher ambient temperature drops directly affect the cooling efficiency) Packaging process: four weeks of standard 704 silicone rubber seal.

TEC1-12706 40*40 Chip type: TEC1-12706 External size: 40*40*3.75mm Internal resistance: 2.1 ~ 2.4Ω (ambient temperature 23 ± 1 'C, test 1kHZ Ac) Maximum temperature difference: Tmax (Qc = 0) above 59 'C Working current: Imax = 4.3-4.6A (rated at 12V) Voltage: 12V (Vmax: 15V starting current 5.8A) Cooling power: Qcmax 55W environment in Operation: Temperature range -55 'C ~ 83'C (High ambient temperatures directly affect cooling efficiency)

TEC1-12708 40*40 Chip type: TEC1-12708 External size: 40*40*3.5mm Internal resistance: 1.5 ~ 1.8 Ω (23 + / - 1degree, environmental temperature 1 KHZ Ac test) The temperature difference is large. Maximum: delta Tmax (Qc = 0) greater than 67degree Working current: Imax = 8 (initial voltage) Voltage: DC12V (Vmax: 15.5 V) Cooling power: 77 W Qcmax Compound voltage: 85 n/cm2 Working conditions: temperature range and 55 degrees ~ 83 degrees (high environmental temperature will directly affect the cooling efficiency) Encapsulation process: standard about 704 silicone rubber seal Packing: bubble box packing, storage conditions. - Ambient temperature 10 degree to 40 degree. Storage condition: - 40 ~ 60degree.

TEC1-12709 40*40MM Chip model: tec1-12709 Overall dimensions: 40*40*3.5 mm, 127 pairs of logarithmic components Wiring specifications: RV standard conductor, length 300 ± 8 mm, single head tin-plated 5 mm Internal resistance: 1.4~1.5ω (ambient temperature 23±1°, AC test 1kHZ) Maximum temperature difference: above 62° Operating current: imax=7.1A (maximum voltage 5V start 9A) Voltage Nominal electricity: $literal (maximum voltage: 5V) Cooling power: 86W (high cooling surface temperatures reduce cooling power) Assembly voltage: 85n/cm2 Working environment: temperature range - 55°~83° (High ambient temperature will directly affect the cooling efficiency) Packaging process: ambient standard 704 silicone rubber seal. Packaging standard: foam box packaging Storage conditions Ambient temperature -10°~40° Storage conditions:-40~60° Power requirements: Single voltage 12V, current 9A above usable power supply. (serial and parallel) Device characteristics: positive red line, negative black line (actual cooling surface no heat dissipation surface literally)

TEC1-12710 40*40 Chip: TEC1-12710 Size: 40*40 127*3.4mm Logarithmic components Wiring specifications: RV lead wire, length 300 + / - 5 mm, single head, tin-plated 5 mm, internal resistance: 1.2 ~ 1.5 Ω (23 + / - 1degree, environmental temperature 1 KHZ Ac test) Maximum temperature difference: delta Tmax (Qc = 0) above 60degree Operating current: Imax = 10 Voltage (vmax 15 initial) Voltage: DC12V (Vmax: 15.5 V) Cooling power: 92 w Qcmax Compound voltage : 85 n/cm2 Working conditions: temperature range and 55 degrees ~ 83 degrees (high environmental temperature will directly affect the cooling efficiency) Encapsulation process: standard about 704 silicone rubber seal Packing: bubble box packing, Storage condions - 10 degrees to 40 degrees ambient temperature Storage condition: - 40~60degree

TEC1-12712 40*40 Type: TECI-12712 Pair: 127 Imax (A) : 12 Umax (V): 15.4 Qcmax(w) T =0: 109 Tmax (°) Qc=0: 68 Size : 40*40*3.4mm

TEC1-12715 40*40 Model: TEC1-12715 Size: 40mm x 40mm x 4mm Working from 0 ~ 15.4V DC and 0 ~ 15A Operating temperature: -40 to 90 Maximum power consumption: 165W